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 New! from O.C.White: 3D-BGA INSPECTION SYSTEM is the highest quality bench top 3 dimensional BGA inspection system available today. Featuring an advanced 3-Chip CCD Camera! Constructed with ESD safe components, it enables the operator to inspect BGA, PBGA, CBGA and MICRO-BGA for micro-cracking, surface structure, excess flux residue and much more. |
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The 3D-BGA Inspection System
The lens offers an incredible depth of field from a magnitude of 50X to 200X. With a quick and easy turn of the adjustment ring the lens is rotated to yield clear, sharp 3D images from various angles. Never before has it been so easy to view the quality of the solder joints, solder paste print, surface structure, placement, alignment and flux process. The images come alive!
12V light source provides 4 fiber optic light bundles with intense white light at 5500°K; a process that provides true daylight illumination for color rendering and color balance. No blind spots! The external power supply is capable of operating between 90 and 240VAC at 50-60HZ and the AC input cord is interchangeable with international cord sets.
The clearest, sharp and bright 3D images are captured by Panasonic's Finest Hi-Resolution 3-Chip CCD camera and transmitted to a Sony Hi-Resolution 15" color monitor. 3 Chip Camera Technology makes the images displayed by O.C. White's 3D BGA Inspection System unbeatable! No more back fatigue and neck strain from microscope inspection. Now you can inspect from an ergonomically correct posture.
Easily functional, attractive and durable support system specially designed for precise fine focusing applications. |
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Industry's Best Production Magnification Solutions O.C. White Company . . . . . Making Light Work
Copyright © 1996-2001, O.C. White Company All Rights Reserved. |
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A REVOLUTIONARY LENS...